BSI Updates January 2018

3rd January

PRINTED BOARD ASSEMBLIES –
Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

IEC 61191-1 Part 1: Generic specification pdf Login
 4th January Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for base materials for rigid printed boards – Moisture Absorption after pressure vessel conditioning  IEC 61189-2-630 pdf Login 
 20th January  Doug Sobers and Steve Tisdale’s current update on IEC TC111 and the Ban on PTFE: Update  IEC 63031 Update PDF