For more information contact EIPC: K. Smit-Westenberg

Bourgognestraat 16, NL-6221 BX Maastricht, Internet:

Tel: +31-43-3440872, Fax: -73, e-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.

The EIPC is the European

representative at the WECC


Roadshow Workshop on Reliability

Date: Tuesday January 25, 2011

Location: Enthone Ltd., Woking, Surrey, UK

12:00-12:30 Registration and “Snack Lunch”

12:30-13:45 Part 1: Materials and surface finishes

l New laminate with better performance

l New surface finishes for solderable and wire bonding surface finishes

l Evolution of solder mask. What is new?

l Flamability Testing

UL-Listing how to manage cost and how to speed up new material qualification

13:45-15:15 Part 2: Thermal Testing Overview

l The IST Test Method

l Overview of Testing both Copper Structures and Material Reliability

l New, Cutting Edge Reliability Methods, Equipment and Techniques

15.15-15:30 Coffee break

15.30-17:00 Part 3: Reliability testing using IST test methods

l IST Applied-Overview of the Affect of Lead Free Assembly on PWB Reliability

l Field Experience

l How to set up the test process including the coupon design

l How to manage testing in running production

l Failure Modes- PTHs, Micro-via-holes, Buried Vias Delamination,

Cohesive Failure, Crazing

l Sharing experience in reliability prediction

17:00-17:30 Part 4: Final panel discussion with all speakers