Reliability designed, Reliability delivered

 

 

 

 

 

 

EIPC in association with DfR Solutions

Date: Monday 17 & Tuesday October 18, 2011

Location: Enthone Ltd., Woking, Surrey, UK

Monday October 17, 2011

Outline Workshop on Design for Manufacturing (DfM):

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Module 1: Introductions

 

 

 

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Module 2: Industry Standard Design Rules

 

 

 

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Module 3: Overview of DfM tasks

 

 

 

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Module 4: DfM- Component

 

 

 

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Module 5: DfM- Printed Circuit Board

 

 

 

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Module 6: DfM- Solder

 

 

 

Tuesday October 18, 2011

Outline Workshop on Next Generation Technologies

in Electronic Packaging and Production

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Module 1: Component Packaging

 

 

 

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Module 2: Printed Board

 

 

 

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Module 3: Assembly

 

 

 

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Module 4: Thermal Solutions

 

 

 

Who should attend?

Design Personnel (managers and engineers), Product Personnel

(managers and engineers), Reliability Personnel (managers and

engineers), and Executives responsible for insertion of new technologies.