NEW! Improve PCB fabrication yield through an advanced copper activation and cleaning system with automatic process control.
Get information on latest developments on copper activation in PCB fabrication at the sponsored dedicated Workshop at Productronica

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Date:
November 17, 2011

Time: 10:30-12:45 hrs
Location: Messe München International, Room B21 (above hall B2)

Address: Messegelände, 81823 München, Germany


Programme highlights:

  • Introduction copper activation in PCB fabrication
  • Copper activation chemistry versus copper cleaning system from one supplier
  • The copper activation system: Equipment, Chemistry and Know-How
  • Waste Treatment of processing chemistry
  • Copper activation processes for pre-lamination cleaning for etch resist
  • Copper activation processes for pre-lamination cleaning for plating resist
  • Copper activation of ML-inner-layer before pressing
  • Copper activation processes before applying solder mask
  • Calibration of Central Processor Unit based on chemistry and products that are manufactured
  • How to combine used equipment with the advanced copper activation

    system

  • Typical technical specification of the advanced copper activation system for different application
  • User experience with the new system
  • Value in Use of the Cu-Activation System
  • Q & A


Dedicated workshop at Productronica 2011 in Munich
Registration is free of charge. Make your reservation soon to ensure a confirmed registered seat at the workshop.
Download here the registration form.
Download here the workshop programme.

For more information: EIPC Services BV, Bourgognestraat 16, NL-6221 BX Maastricht
Tel: +31-43-3440872, Email: This email address is being protected from spambots. You need JavaScript enabled to view it., www.eipc.org


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