Effectiveness of Baking to Remove Moisture from Between PCB Ground Planes – NPL webinar, Thurs 7 June 2012


With the introduction of Pb-free solders there has been in increase processing temperatures such that boards will have a greater risk of delamination in the reflow stage. To abate this risk, boards and components are baked prior to working to remove the internal moisture content. The flow of moisture is governed by the diffusion equation and moisture ingress and removal from ground planes has been experimentally investigated and modelled. Results show that moisture removal is often unfeasible and that in certain situations a baking regime may actually increase local moisture content under a ground plane.


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There are also other webinars coming in near future:


Tues 3 July 2012 - Practical Applications for Printed Electronics


Wed 15 August 2012 - Review of Life Cycle Analysis (LCA) Modelling in the Development of RoHS & WEEE


Wed 17 October 2012 - Practical Applications for Nano Electronics


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