Event Sponsors 

Thursday June 9, 2016 at 8:30 AM CEST
Friday June 10, 2016 at 4:00 PM CEST

Macdonald Holyrood Hotel
81 Holyrood Road
Edinburgh EH8 8AU
United Kingdom
Contact EIPC
Bourgognestraat 16 
NL-6221 BX Maastricht 
Tel: +31-43-3440872 
Fax: +31-43-3440873
Kirsten Smit-Westenberg 
Executive Director 
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Sonja Derhaag 
Event Manager 
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Register now for the EIPC Summer Conference Edinburgh! 

Early bird registration deadline: May 6, 2016
Date: June 9 & 10, 2016 
Location: Macdonald Holyrood Hotel, Edinburgh, Scotland
Bonus programme: a boat trip on The Scottisch Canals and Falkirk Wheel, a unique piece of modern engineering  

Programme overview 

Management Session
The global trend in electronics, and its impact to the European electronics and PCB industry, will be illustrated. In addition, a new initiative will be introduced, one that will show European market developments and trends based on industry data.
Session 1: Safety, Quality & Reliability of ML-PCBs
New developments in components, materials and PCB fabrication technology require very advanced test methods depending on market segments. The European Space Agency (ESA) will share their experiences with the control of the supply chain. UL will provide the latest changes in material safety standards as well as their PCB validation service and some new test methods and technologies that have been introduced.
Session 2: Future technology in components, materials and processes
Electronic components are defining the design and fabrication of electronic devices. The PCB fabrication processes have to meet these changes and the needs of the components that are used to fulfil the end user requirements. The session will show some examples of this from the automotive industry.
Session 3: Latest developments in Final Solderable Finishes for PCBs
The changes in soldering of components to the printed circuit board have been manifold. On the one hand, the highest First Pass Yield are needed to maintain profitable, whilst on the other the move to lead-free soldering has increased the soldering temperature. Also, the market now demands multiple soldering processes. In this complex field, this session will provide details and trends in solderable finishes and will indicate the limitation of existing technologies and will show opportunities to improve first pass yield.
Session 4: Fabrication experience with advanced technologies
Continuous improvement is part of the PCB fabrication processes, and here Design for Manufacturing (DfM) is very much a part of the on-going process improvement programs. Existing technologies are re-evaluated to improve equipment and fabrication technology for the benefits of the end-user. This session will show some of the trends and improvements opportunities for PCB fabricators, designers and equipment / material suppliers.
The detailed conference programme will be available soon.
You can download the conference registration form by clicking here.
The 3rd and further registration from the same company will get 50% dicount on the registration fee! 
Special Student fee: € 150.- FC including Bonus Programme.
In case of any questions please feel free to contact us at This email address is being protected from spambots. You need JavaScript enabled to view it. or +31-43-3440872. We look forward to welcoming you in Edinburgh!
Kind regards,
The EIPC Team


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