Index of Journals of The Institute of Circuit Technology
Welcome to the ICT Journal Archive. Since 2008, the Institute of Circuit Technology has published the ICT Journal, providing an international forum for technical papers on printed circuit board (PCB) manufacturing, materials, reliability, HDI, flexible circuits, surface finishes, assembly technologies and other developments across the electronics manufacturing industry. Browse the complete collection of journal issues below.
Looking for a specific technical paper? Visit the Index of Papers.
To access any journal click the "Vol link" in the left column.
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| Vol 19 No 3 August 2026 |
Paper 1 explores how modern solder masks exceed the traditional design rules for insulation and creepage. Paper 2 seeks to explain and clarify the key metallurgical and process factors that determine the reliability of stacked microvias. Paper 3 an article on the prospects of resolving the worldwide shortage of electronics grade glass fabric and the actions that are in progress. There are some interesting topics in the sections on members and Industry news. |
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| This edition features two technical papers: Paper 1 A Review of HDI PCB Technology Innovations, Applications and Future Prospects, which serves as both a valuable refresher for experienced readers and an accessible introduction for those newer to the topic. Paper 2 Cutting‑Edge Pulse Plating Solutions for Uniform Deposition of Copper, a process increasingly essential for state‑of‑the‑art server technology.
We also include a technical article from Alun Morgan highlighting the pressures that AI‑driven server manufacturing is placing on the materials supply chain. In this issue you will also find a review of our popular Foundation Course in PCB Manufacturing from Emma Hudson, along with a summary of our recent Evening Seminar by Pete Starkey. |
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| Welcome to the winter edition of our Journal. There are 2 papers, Capabilities and Challenges in Taking the Step from HDI to Advanced HDI and Study of Hole Wall Dielectric Crack Defects in Power Module Heavy Copper Printed Circuit Boards. We have reviews of our Annual Symposium and Christmas Technical Seminar and an article from Alun Morgan - The AI Boom is Driving Technological Change at Every Level - Beware. There are also Members and Industry news sections. I hope you find the contents interesting. |
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The theme of this edition is sustainability which complements our forthcoming Annual Symposium on 1st October. It is sad to report the passing of Walt Custer. One of our PCB legends. Such a knowledgeable and engaging person. We include a short tribute by Dan Feinberg. We have included 3 papers: 1. Sustainable Smart Surfaces: moulded electronics for decreasing material usage, implementing additive processes and simplifying the supply chain. We have an article by Alun Morgan on the adoption of additive processes after first being discussed at the first Printed Circuit World Convention in 1978 |
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We have included papers on Managing Backdrill Stub length and Vacuum Etching for Fine Lines. We have a review of our flagship foundation course together with Industry and Membership news. There is a special section highlighting the EIPC Summer conference in Edinburgh. I am particularly grateful to Pete Starkey and i-Connect007 for permission to publish his reviews. This is certainly a premier event and is a great flagship for our industry. I wish I had been there. Dieter Weiss has provided a market report titled The European PCB Industry is in Danger featuring PCB Manufacturing in Europe, showing companies by size and market sectors. |
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Will 2025 bring new solutions to familiar challenges? Alun Morgan. China Becomes a Contender in Quantum Computing Pablo Valerio. Christmas Seminar - Steve Driver, Andrew Norton, Neil Chamberlain. Impact of Donald Trump's Presidency on the UK and European PCB Industry. Spring Seminar Review, Pete Starkey. Impact of Particular Stages of the Manufacturing Process on the Reliability of Flexible Printed Circuits, Andrzej Kiernich et al. Deposition of Diamond Coatings on Ultrathin Microdrills for PCB Board Drilling, Shuangqing Zhou et al. |
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| 50th Anniversary of the ICT, Pete Starkey. 50th Anniversary Celebration Dinner, Emma Hudson. UK PCB Production - 50 Years on, Bill Wilkie. A Circuit Board Printer In Space: Zero Gravity Electronics Manufacturing For Space Force, BotFactory Inc. | ||
| Chip Removal Mechanism and Hole Cleanliness in Back-drilling of High-speed Printed Circuit Boards, Zhuangpei Chen et al. Comparison of Non Destructive Testing Techniques for PCB's, Elena Jasiūniene et al. Soldering Defects on Immersion Tin and the Impact of the Tin-oxide Layer, Atotech, Britta Schafsteller et al. Foundation Course Review - Our annual successful training program, Emma Hudson. | ||
| 5G is Setting Stage for 6G, Isola Asia Pacific (Taiwan) Inc. Fandy Wei. Recent Developments in Advanced Polymeric Materials for Solder Mask Application, Vietnam National University, Hanoi, William Yung Ling Lim et al. Influence of Substrate on Microvia Structures in Printed Circuit Boards During Reflow, Yokohama National University, Japan, Syed Mujahid Abbas et al. Spring Seminar Review, Pete Starkey.
Obituary - Dennis Price, Bill Wilkie |
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Lessons Learned While Investigating Microvia Reliability Failures, Atotech, Germany. Development of Low Loss Adhesive Film for Multilayer PTFE Substrate. Resonac Group, Japan. Picosecond Laser Microvia Drilling of ABF Material Using MHz Burst Mode. Applied Laser and Photonics Group and Schmoll Maschinen, Germany |
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