| Modern Solder Masks Challenge Traditional Creepage Design Rules: This paper examines whether modern solder mask technologies can deliver significantly better insulation performance than long-established design assumptions. |
M. Vogt et al |
Vol 19 No 3 |
Aug 2026 |
| Reliability starts at the Cu/Cu/Cu microvia junction: This paper examines some of the key metallurgical and process factors that determine the reliability of these increasingly critical interconnections. |
Kuldip Johal et al |
Vol 19 No 3 |
Aug 2026 |
| Electronic E-Glass Fabric - Why capacity investment will not quickly end the shortage: This paper examines the substantial new capacity now being announced and explains why converting that investment into stable, qualified electronic glass fabric will take time. It also highlights the growing geographical concentration of this strategically important part of the PCB materials supply chain. |
Mark Goodwin
Ventec
|
Vol 19 No 3 |
Aug 2026 |
| Cutting-Edge Pulse Plating Solutions for Uniform Deposition of Copper with Enhanced Reliability in State-of-the-Art Server Technology |
Dirk Ruess et al |
Vol 19 No 2 |
May 2026 |
| High Density Interconnect (HDI) Printed Circuit Board Technology Innovations, Applications and Future Prospects |
Arabinda Panigrahy et al |
Vol 19 No 2 |
May 2026 |
Study of Hole Wall Dielectric Crack Defects in Power Module Heavy Copper
Printed Circuit Boards |
Sun Fu et al |
Vol 19 No 1 |
Jan 2026 |
| Capabilities and Challenges in Taking the Step from HDI to Advanced HDI |
Roger Massey et al |
Vol 19 No 1 |
Jan 2026 |
| Can Assembly Materials Help You Achieve Your Sustainability Objectives? |
Jen Fijalkowski
et al |
Vol 18 No 3 |
Oct 2025 |
| Investigation into the Performance of Concrete and Mortar incorporating Printed Circuit Board E-Waste |
Srinivasan Krishnan et al |
Vol 18 No 3 |
Oct 2025 |
| Sustainable Smart Surfaces |
Outi Rusanen |
Vol 18 No 3 |
Oct 2025 |
| Vacuum Etch Technology for Fine Line Width and Space in PCB's |
Reginald Lai, Intel Corp |
Vol 18 No 2 |
Aug 2025 |
| Managing Backdrill Stub Length Variations due to Innerlayer Core Deformation |
Gary Brist, Siemens |
Vol 18 No 2 |
Aug 2025 |
| Deposition of Diamond Coatings on Ultrathin Microdrills for PCB Board Drilling |
Shuangqing Zhou et al |
Vol 18 No 1 |
Mar 2025 |
| Impact of Particular Stages of the Manufacturing Process on the Reliability of Flexible Printed Circuits |
Andrzej Kiernich et al |
Vol 18 No 1 |
Mar 2025 |
| A Circuit Board Printer In Space: Zero Gravity Electronics Manufacturing For Space Force |
BotFactory Inc |
Vol 17 No 4 |
Nov 2024 |
| Chip Removal Mechanism and Hole Cleanliness in Back-drilling of High-speed Printed Circuit Boards |
Zhuangpei Chen et al |
Vol 17 No 3 |
July 2024 |
| Comparison of Non Destructive Testing Techniques for PCB's Produced Using Traditional vs Additive Processes. |
Dr Elena Jasiūnienė et al |
Vol 17 No 3 |
July 2024 |
| Soldering Defects on Immersion Tin and the Impact of the Tin-oxide Layer |
Britta Schafsteller et al |
Vol 17 No 3 |
July 2024 |
| Influence of Substrate on Microvia Structures in Printed Circuit Boards During Reflow. Yokohama National University, Japan. |
Syed Mujahid Abbas et al. |
Vol 17 No 2 |
Apr 24 |
| Recent Developments in Advanced Polymeric Materials for Solder Mask Application. Vietnam National University, Hanoi. |
William Yung Ling Lim et al. |
Vol 17 No 2 |
Apr 24 |
| 5G is Setting Stage for 6G. Isola Asia Pacific (Taiwan) Inc. |
Fandy Wei |
Vol 17 No 2 |
Apr 24 |
Picosecond Laser Microvia Drilling of ABF Material Using MHz Burst Mode.
Applied Laser and Photonics Group and Schmoll Maschinen, |
Daniel Franz
et al. |
Vol 17 No 1 |
Jan 24 |
Development of Low Loss Adhesive Film for Multilayer PTFE Substrate.
Resonac Group, Japan. |
Yusuke Watase
et al. |
Vol 17 No1 |
Jan 24 |
| Lessons Learned While Investigating Microvia Reliability Failures |
Tobias Bernhard et al. |
Vol 17 No 1 |
Jan 24 |
| Study on Wet Chemical Etching of Flexible Printed Circuit Board with 16‑μm Line Pitch, |
Hui Li, Wuhan University. |
Vol 16 No 4 |
Oct 23 |
| Digital and Environmental Circuit Board Manufacturing Based on Continuous Laser Assisted Deposition |
Michael Zenou, ioTech Group Ltd |
Vol 16 No 4 |
Oct 23 |
| Understanding Electroless Nickel Thickness in ENIG and ENEPIG |
Robert Weber, Fischer Technology Inc. |
Vol 16 No 4 |
Oct 23 |
| Reassessing Surface Finish Performance for Next Generation Technology - Part 1. MacDermid Alpha Electronics Solutions |
Frank Xu |
Vol 16 No 3 |
Jul 23 |
| Photoresist Adhesion Promoter for HDI-PCB Fabrication. Atotech Deutschland GmbH |
Christopher Seidemann |
Vol 16 No 3 |
Jul 23 |
| The Challenges in Selective Soldering and Meeting Training Needs. Pillarhouse International Ltd |
Sam McMaster |
Vol 16 No 3 |
Jul 23 |
| Practical Aspects of Selective Etching for High Density Interconnect |
Don Ball |
Vol 16 No 2 |
Apr 23 |
| Thermal Management in High Performance RF and Microwave PCB's |
John Priday |
Vol 16 No 2 |
Apr 23 |
| Two-Layer Solder Resist Film for High Reliability |
Ying Hsuan Chou |
Vol 16 No 2 |
Apr 23 |
| Treatment of Polymeric Films Used for Printed Electronic Circuits Using Non-Thermal Plasma |
Radu Burlica |
Vol 16 No 2 |
Apr 23 |
| IPC Warning about Microvia Reliability for High Performance Products |
Happy Holden |
Vol 16 No1 |
Jan 23 |
| Process Improvement Strategies for Weak Microvia Interfaces |
William Bowerman |
Vol 16 No1 |
Jan 23 |
| Ultra Thin Base Materials Take PCB Manufacturing to the Next Level |
Daniel Schulze |
Vol 16 No1 |
Jan 23 |
| Computer Aided Engineering Simulation for Production Proofing PCB Copper Plating |
Robrecht Brelis |
Vol 16 No1 |
Jan 23 |
| Synthetic Graphite: A New Solution for PC Board Thermal Management |
John Priday |
Vol 15 No 3 |
Oct 22 |
| Selective Soldering: A need for Innovation and Development |
Samuel McMaster |
Vol 15 No 3 |
Oct 22 |
| Solder Joint Reliability in Light Emitting Diode Modules |
Martin Goosey |
Vol 15 No 3 |
Oct 22 |
| How Flexible Printed Circuit Technology is Enabling Cell-to-Pack EV Batteries |
Philip Johnston |
Vol 15 No 2 |
Jun 22 |
| Thin High Phosphorous Electroless Nickel for 5G |
Matt Sylvestre |
Vol 15 No 2 |
Jun 22 |
| Knowledge Exchange - Coventry University Industry Partnership |
Helen Lau |
Vol 15 No 2 |
Jun 22 |
| The Power Mesh Architecture for PCBs |
Happy Holden |
Vol 15 No 1 |
Mar 22 |
| Microvia Process Guidelines |
Stan Heltzel |
Vol 15 No 1 |
Mar 22 |
| UL Solder Limits – The Latest Update on What the Future Holds |
Emma Hudson |
Vol 14 No 3 |
Oct 21 |
| PCB Solderability Assessment - During and Pre-Production |
Bob Willis |
Vol 14 No 3 |
Oct 21 |
| New PCB Material for Demanding High Temperature and High Voltage Requirements of the Rapidly Growing Automotive EV Market |
Anna Graf and Michael J Gay |
Vol 14 No 2 |
Aug 21 |
| Choosing the Right Materials is Tougher Than Ever |
Mark Goodwin |
Vol 14 No 2 |
Aug 21 |
| Ultra Low Profile Copper for Very Low Loss Material |
Thomas Devahif |
Vol 14 No 2 |
Aug 21 |
| 5G Driving High-Performance Material Demand |
Alun Morgan |
Vol 14 No 1 |
Mar 21 |
| 5G+ Readiness and Challenges |
Stig Källman |
Vol 14 No 1 |
Mar 21 |
iNEMI Projects and Initiatives
Address 5G/mmWave Challenges |
Urmi Ray and Steve Payne |
Vol 14 No 1 |
Mar 21 |
| 3D Printing of Electronic Systems for Real World Applications |
Robert Kay and Matthew Shuttleworth |
Vol 14 No 1 |
Mar 21 |
| A Second Life for Electric Vehicle (EV) Batteries |
Martin_Goosey |
Vol 13 No 3 |
Dec 20 |
| A Market Research Project in Industrial Applications for a University Developed Technology - SMMF |
Sofya Danilova |
Vol 13 No 3 |
Dec 20 |
| Inkjet Printing of Polyacrylic Acid-Coated Silver Nanoparticle Ink onto Paper with Sub-100 Micron Pixel Size |
Mavuri, Mayes and Alexander |
Vol 13 No 3 |
Dec 20 |
| Selective Metalisation Using a Magnetic Field Technology |
Sofya Danilova |
Vol 13 No 3 |
Dec 20 |
| Shrinking Medical Labs onto Printed Circuit Boards for Disease Management |
Despina Moschou |
Vol 13 No 2 |
Sep 20 |
| Fully Biocompatible Epoxy Acrylate Dry Film for MEMS, Lab-on-chip, Microfluidic and Medical Devices |
Giorgio Favini |
Vol 13 No 2 |
Sep 20 |
| Development and processing of an ink jettable soldermask and advantages of use in PCB manufacture |
Chris Wall |
Vol 13 No 1 |
Mar 20 |
