|
Industry News January 2026 |
||
|
Hofstetter PCB Group purchases Mass-PCB Vacuum-Filling & Planarising system from Adeon Technologies for starting its Via Filing Subcontract Services. |
||
|
Introducing Cuprapulse XP7-UA – our advanced vertical reverse pulse plating (RPP) process for package substrate core plating with inert anodes. Designed for cutting-edge applications like AI, 5G, and high-performance computing, Cuprapulse XP7-UA delivers: |
||
|
Introducing BondFilm® LDD and BondFilm® LDD SR – our next-generation pre- and post-treatment solutions designed to optimize the laser direct drilling (LDD) process in advanced PCB and package substrate manufacturing. In today’s high-density designs, every via counts. BondFilm LDD creates an ultra-branched brown oxide layer that absorbs laser energy more efficiently, reducing backscatter and lowering the energy required per pulse. The result is better via geometry, improved drilling precision and higher throughput, particularly when used with state-of-the-art laser systems. Read more... |
||
|
ElectraJet EMJ110 inkjet soldermask contains zero SVHCs — meaning nothing to declare under REACH. A simple, future-proof choice for manufacturers navigating tightening regulatory requirements. Read more... |
||
It’s been a big year of progress here at The Eurotech Group. Since closing our Poole site and transferring all flex and flex-rigid PCB manufacturing to our main facility in Exmouth, our focus has been on growth, efficiency, and continuous improvement. Bringing all production under one roof has allowed us to streamline operations, improve lead times, and strengthen collaboration across our teams. Admittedly, there were a few challenges along the way — as with any major transition, but our team has shown incredible resilience and teamwork throughout. Read more... |
||
We’re evolving and proud to share the next step in our journey. Over the coming months, you’ll start to see our refreshed identity appear across Exception PCB. Our new logo brings us visually in line with the Connexion Technologies group, reflecting the close collaboration, innovation, and shared values that unite us. We’re proud to be part of the Connexion Technologies group and excited for what’s ahead. Read more... |
||
|
Following valuable comments made through surveys and conversations, we’re proud to announce a change that will deliver both cost savings and enhanced performance for our customers. From today, thanks to Solder Connection we are transitioning to Tannlin stencils using the DEK VectorGuard™ frame system developed by Tannlin. This move allows us to reduce stencil costs significantly while introducing a more advanced, flexible solution for PCB assembly. Read more... |
||
|
Graphic Passes ECJU Audit. We’re delighted to share that Graphic has successfully passed another Export Control Joint Unit (ECJU) audit. Our processes were described as “faultless”, reflecting our commitment to the highest standards in exporting compliance for aerospace, defence, and security markets. Read more... |
||
|
Our on-site solar farm now generates around 25% of the electricity used to power our PCB facility. This reduces our environmental impact while supporting more sustainable production for our customers across defence, medical and industrial sectors. Read more... |
||
|
|
||
|
Transforming Electronics Through Material Innovation Jiva Materials Collaborates with the University of Glasgow to Advance Biodegradable Circuit Boards for High-Speed Electronics. We’re proud to share that Jiva Materials has been featured in a new research paper from the University of Glasgow’s James Watt School of Engineering, highlighting a major step forward in the development of biodegradable printed circuit boards (PCBs) for next-generation electronics. Read more... |
||
|
The Merlin PCB group has invested in CIMS Galaxy 25µ AOI machines, one for Merlin Flex in Hartlepool and the other for Merlin Circuit Technology in Hawarden. Both machines are the latest technology from CIMS and substantially increases the in-line inspection capability at both facilities. Read more... |
||
|
Schmoll Maschinen secured the Silver Award at the prestigious Productronica Innovation Award for our groundbreaking PICO+CO2 hybrid laser technology. This hybrid system sets new industry standards by combining the ultra-clean processing of the picosecond laser source with the efficiency of the CO2 laser. This powerful combination enables unparalleled precision, speed, and material versatility for complex PCB and advanced packaging applications. Read more |
||
|
The message is clear cost & prices are rising as demand eats capacity – so is now the time to secure your supply chain for key materials? A quick look at the PCB industry news channel and it is plain to see that there Is a well documented boom in demand for high-end materials for AI, but the impact of the trickle down effect is often overlooked. Read more... |
