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Sustainable UltraSonically Enhanced Chemical Processes

www.susonence.eu

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Advanced Surface Protection for Improved Reliability PCB Systems
www.aspis-pcb.org
Join the EIPC
Interested in becoming an EIPC member?
EIPC membership has many advantages, both financially as in services. Go to www.eipc.org to find out what EIPC can do for you! 
Contact EIPC:
Bourgognestraat 16
NL-6221 BX, Maastricht

K. Smit 2012 
Kirsten Smit-Westenberg

Executive Director
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S Derhaag 2012 
Sonja Derhaag
Event Manager
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Tel:+31-43-3440872
Fax: +31-43-3440873

The EIPC has made an effort to provide the latest information on Standards for PCBs from Japan. The 4th edition was released at the JPCA Show beginning of June 2011. The EIPC is encouraging the specialists in the European Electronic Industry to learn the knowledge that has been cumulated by the Japan Electronics Packaging and Circuits Association (JPCA) and documented in the:
 

Standard on Device Embedded Substrate

Terminology Reliability Test/Design Guide

-Edition 4.0-

JPCA-EB01 (2011)

The English version of the document is on stock at the EIPC office in Maastricht, The Netherlands.

Please contact Kirsten Smit-Westenberg on This email address is being protected from spambots. You need JavaScript enabled to view it." target="_blank">This email address is being protected from spambots. You need JavaScript enabled to view it. or call +31-43-3440872. Download herethe Standard order form.

The costs are:
€ 150.- (excluding handling and shipping for EIPC members)
€ 250.- (excluding handling and shipping for non-members)

The JPCA-EB01 standard is a 200 page (hard copy) document that contains a large number of Terminologies, Reliability Test and Design Guide options for Embedded devices, e.g.:
Scope of product; Base Embedded Devices, Mounting and Interconnections; Fabrication Process; Structure and Terminology; Interconnections and Structure of the Device Embedded Board including Naming of Each Section; Test Condition and Sample Preparation; Test Specimens and Number of Specimens to be used; Test Element Group (TEG); Preparation of TEG; Structures of TEG, Test Pattern Guide; Test Methods; Visual test and Micro-sectioning; Visual Test Micro-Sectioning; Dimensional Tests Dimensions; Thickness; Hole Diameter; Hole Position, Conductor Width and Minimum Conductor Width; Conductor thickness and wall plated film thickness; Environmental Tests and many more.

See details in English at the Table of content
  JPCA picture small no text

Figure 1-2 Device embedded board (via connection)

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