Teledyne Labtech is recognised as a world leading supplier of complex RF PCB and Microwave Printed Circuit Boards. With over 35 years’ experience, Teledyne Labtech is your “one-stop” solution for design, manufacture and test of the most demanding RF/Microwave PCB designs.

Teledyne Labtech is unique in offering a complete microelectronic assembly capability. This includes MMIC die-placement, wire bonding, ribbon bonding, wedge bonding and ball bonding. This capability ensures that any RF/Microwave PCB and assembly meets with the most demanding communications and space applications.

Teledyne Labtech also have extensive microwave alignment and microwave testing facilities. This includes the ability to test noise figure, S-parameters and harmonics. This ensures that Teledyne Labtech can supply a fully compliant product and provide a complete turnkey microwave assembly and test solution.

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