|
Link
|
Contents
|
Size
|
|
Volume 11 No 2
|
This is now listed in the public area under menu heading "News and Reports"
|
On-line
|
|
Volume 11 No 1
|
Solder Limits Updated for Surface Mount, Institute of Circuit Technology Harrogate Seminar 2017, Magnetic Field Enabled Selective Metallisation of
Dielectric Substrates,
|
1Mb
|
|
Volume 10 No 4
|
Additive Manufacture of Microwave Substrates. Mr Laminate tells all about PTFE. ICT Hayling Island Seminar.
|
.7Mb
|
|
Volume 10 No 3
|
Electronics Compliance after BREXIT, Megasound acoustic agitation for enhanced copper electrodeposition in via interconnects, ICT 43rd Annual
Symposium.Dudley,UK,9th May 2017, Foundation Course - First Year at Chester University
|
2Mb
|
|
Volume 10 No 2
|
ICT Spring Seminar, Macfest Update, PCB Market Analysis, PCB Technology Requirements for Millimeter-Wave Interconnect and Antenna, PCB Fabricator History Update, AGM Minutes.
|
2 Mb
|
|
Volume 10 No 1
|
ICT Harrogate Seminar. EIPC Workshop on Bio MEMs. Benchmarking New Solderable Finish. Brief History of UK Captive PCB Fabricators.
|
1.5Mb
|
|
Volume 9 No 3
|
42nd Annual Symposium Birmingham, 7th Workshop Materials and Processes for Space, Book Review: Materials and processes for Spacecraft and High Reliability Applications.
|
2.5Mb
|
|
Volume 9 No 2
|
Tewkesbury Seminar, Reprime Project, Macfest Project, Obituary - John Walker
|
3.0Mb
|
|
Volume 9 No 1
|
Market Data, Darlington Symposium.
|
1.5Mb
|
|
Volume 8 No 4
|
Hayling Island Seminar, R & D Projects update - STOWURC, MACFEST and REPRIME 2, ICT/NUKCG Foundation Course, 1988 Exam Paper!
|
2Mb
|
|
Volume 8 No 3
|
Visit to Cemco in Waterlooville, 6th Electronic Materials and Processes for Space Workshop, Isola & Holders Technology Seminar, Institute of Circuit Technology 41st Annual Symposium,
|
3.5Mb
|
|
Volume 8 No 2
|
New Chairman - Andy Cobley. ICT Seminar Sanbach 03 Mar 2015, STOWURC, MACFEST, Themal Management: The role of the Substrate, IPC Training Centre, International Electronics Manufacturing Initiative. A visit to see the Eurofighter assembly at Airbus Defence and Space. Southern Manufacturing and Electronics Show
|
1.5Mb
|
|
Volume 8 No 1 Supplement
|
IeMRC 9th Annual Conference review. EIPC Winter Conference Day 1. EIPC Winter Conference Day 2
|
1.6Mb
|
|
Volume 8 No 1
|
Smaller, lighter and Faster PCB's. A Celebration of Paul Eisler. New Accoustic Pre-Treatment Processes for PCB's. Review of ICT Darlington Seminar, Nov.18th 2014. PCB Effluent Treatment Mth.12 Update
|
3Mb
|
|
Volume 7 No 4
|
Collaborative Research Projects. Low Frequency Ultrasound. ICT Hayling Island Seminar, “Manufactured in the UK” - September 23rd 2014. Dieter Bergman — a personal remembrance. KTP News
|
1Mb
|
|
Volume 7 No 3
|
Sustainable Solder Flux from Novel Ionic Liquid Solvents update. Crab Shell Biosorbents and Metal Recovery from PCB Effluent. Review of the UK PCB Industry in 2013. 13th Electronic Circuits World Convention : “Connecting the World” The Markets Session, The Embedding Technology Session, The Metal-Base PCB Technology Session, The Drilling and Routing Session. The 40th Anniversary Institute of Circuit Technology Dinner and Annual Symposium.
|
1.4Mb
|
|
Volume 7 No 2
|
Winsford Seminar: Multilayer copper bonding. Copper recovery using crab shells. Soldering fluxes - eutectic solvents v conventional fluxes. Applications of pcb's in miniature. Sustainable Solder Flux from Novel Ionic Liquid Solvents,
|
1.0Mb
|
|
Volume 7 No 1
|
Electronic Materials and Processes for Space, PCB Laminate Supply Issues, PCB Effluent Treatment Process.
|
.8Mb
|
|
Volume 6 No 4
|
Solder flux project, Hayling Island seminar, Creating a lead free control plan, Polymer Electronics, IeMRC Annual Meeting, £250 prize offer.
|
.75Mb
|
|
Volume 6 No 3
|
ICT 39th AnnualSymposium, Raspberry Pi for Dummies, Design Manufacture and Test of High Reliability Electronics, 13th Electronic Circuits World Convention.
|
.6Mb
|
|
Volume 6 No 2
|
IeMRC 7th Annual Conference, Novel Solder Flux Project, Book review - Pulse Plating, ICT Northern Seminar review, The Rainbow Process: It works!
|
2.4Mb
|
|
Volume 6 No 1
|
Large Area Electronics, 6th Int Symposium on Tin Whiskers, RoHS and REACH updates, Seminar Reports Hartlepool and Arundel, NPL Future Events
|
pdf
1Mb
|
|
Volume 5 No 4
|
DNA as a Digital Storage Medium, 38th Annual Symposium papers, Surface Engineering Association project reviews, ICT Hayling Island Seminar, IeMRC Annual Conference.
|
pdf
5Mb
|
|
Index of Topics
|
Index of topics in ICT Journal Volumes 1 and 4. Members are requested to make a trial search and to send their findings to the editor, Bruce Routledge. Email This email address is being protected from spambots. You need JavaScript enabled to view it.
|
pdf
45k
|
|
Index of Authors
|
Index of Authors in ICT Journal Volumes 1 and 4. The index of authors is intended for further research on topics by the same author. Members are requested to make a trial search and to send their findings to the editor, Bruce Routledge. Email This email address is being protected from spambots. You need JavaScript enabled to view it.
|
pdf
45k
|
|
Volume 5 No 3
|
IPC Technology Roadmap, 3D packaging Seminar, Reserach to Industry Electronics Conference, Elimination of Tin Whiskers from Electroplated Tin.
|
pdf
5Mb
|
|
Volume 5 No 2
|
Review of PCB Nickel-Gold surface finish failures webinar. Paper on Graphene and its Potential Interconnect Applications.Review of IeMRC Event - Plastic and Printed Electronics:Interconnects and Manufacturing Challenges.
|
pdf 2Mb
|
|
Volume 5 No 1
|
Paper on Multi Electrode Array (MEA) Biochip, Update on ASPIS. Introduction to Sussonence - a project to develop sonochemical processes to reduce chemical usage. The Good the Bad and the Ugly Ni/Au Webinar review. Report on ICT symposium at Darlington. New R&D funding support announced by IeMRC
|
pdf
8.5Mb
|
|
Volume 4 No 4
|
Paper on Immersion Coating of Copper from a Deep Eutectic Solvent (ASPIS Project). Review of papers from ICT Hayling Island Symposium. Review of IeMRC 6th Annual Conference. Paper on Precision Filmworks and Tooling.
|
pdf 7.5Mb
|
|
Volume 4 No 3
|
Paper on Printed Electronics - Steve Jones, RoHS Directive recast, IC Packagage Innovation - National Microelectronics Institute, ICT 37th Annual Symposium. Frank Coultard Obituary.
|
pdf
5Mb
|
|
Volume 4 No 2
|
ASPIS— a new multi-partner research project to enhance the performance of nickel-gold solderable finishes. Review of Plastic Electronics seminar: the challenges for low temperature manufacturing. 2011 Annual Foundation Course
|
pdf
2Mb
|
|
Volume 4 No 1
|
Paper on "Enhancing the Desmear Process Using Ultrasound", ICT Darlington Seminar Review, A novel method for Solder Paste Test Printing, HDI PCB Production in Europe.
|
pdf
4Mb
|
|
Volume 3 No 4
|
Paper on Development of Ultra Small Micro Drill Bits, Southern Area Seminar, Manufacturing Technology Centre - Electronics Manufacturing Launch
|
pdf
2.9Mb
|
|
Volume 3 No 3
|
Papers on "Energy Conservation and Related Best Practices in PCB Manufacturing", "The UK PCB Industry in 2009". IMAPS-UK Beyond Solder Seminar. RoHS and REACh updates.
|
pdf
2.9Mb
|
|
Volume 3 No 2
|
Papers on "Advancements in Laser Direct Imaging for Solder Mask Applications", "Packaging and Interconnection for Electronics and Sensors – Past, Present and Future" and "Measuring Package On Package — Possible Procedure". Obituary - Bernard Coles.
|
pdf
3.9Mb
|
|
Volume 3 No 1
|
In this issue: RoHS and REACh updates. Book review "Printed Circuits Handbook - 6th Edition". Reports from Darlington Seminar, IeMRC Workshop and Arundel Seminar. An Innovation in Horizontal Processing Part 2.
|
pdf
5Mb
|
|
Volume 2 No 4
|
In this issue: REACh - Implications of Europe's New Chemicals Policy on PCB Fabricators and Assemblers. An Innovation in Horizontal Processing Part 1. New Developments in PCB and Interconnect Manufacturing.
|
pdf
3.2Mb
|
|
Volume 2 No 3
|
In this issue: Overview of European Commission FP7 proposal - Solderable Finishes. ROHS2 update. Report on 35th ICT Annual Symposium. Review of "Nanopackaging - Nanotechnologies and Electronic Packaging", a new book by James E Morris. Review of EIPC Summer Conference held in Austria. Introduction to "SURFENERGY" - a new European project to help the PCB and Surface Finishing Sectors.
|
pdf
3.4Mb
|
|
Volume 2 No 2
|
In this issue: Standards update from Len Pillinger. Review of the ICT Darlington Seminar. Paper on the "Degradation of Chemical Water Pollutants using Ultrasound" Membership news and an update on Group Members.
|
pdf
.8Mb
|
|
Volume 2 No 1
|
This Issue has an update to the Legislation and Standards Digest. A comprehensive list of Acronyms and Abbreviations. A Paper on "Embedded Passive Components". A review of the Technology and Imaging seminar held in Arundel, November 2008. A table of Group Members of the Institute and News from the Membership Secretary.
|
pdf
1.2Mb
|
|
Volume 1 No 4
|
Technical news and updates on legislation. Papers on: "A software tool for predicting the thermal performance of embedded components", "EMI shielding properties of polymer composites" and "PCB solderability changes with time - What finish is best". Also Annual Conference and Plating Technology Seminar reports.
|
pdf
1.6Mb
|
|
Volume 1 No 3
|
This is the third ICT Journal of 2008, with an update on RoHS and REACh legislation. The papers in this issue cover PCB design, whiskers on lead free solder and integrating Optical connections on pcb's.
|
pdf 2.2Mb
|
|
Volume 1 No 2
|
This is the second ICT Journal of 2008, with three papers, including an interesting look at 'PCB's on the Cheap' by the late Dave Kingsley. We have also included write-ups of our last two Seminars. We are looking for feedback, good or bad! Let us know what you think and feel free to forward anything you think would be of interest to Members.
|
pdf .26Mb
|
|
Volume 1 No 1
|
This is the first issue of a new concept ICT Journal. The Journal contains news about the institute, a review of our annual symposium and two technical papers.
|
pdf
.25Mb
|
